DAGE STELLAR 4000 Bondtester
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
DAGE 4000 Plus Bondtester
The 4000Plus multi-purpose bondtester performs shear tests up to 200kg, pull tests up to 100kg and push tests up to 50kg, covering all test applications including new hot bump pull and micro materials tests. This system is also ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.
DAGE 4000HS high Speed Bondtester
The 4000HS Shear Bondtester supports your Semiconductor (Package Assembly and Test), Substrate Manufacturers (New Materials/Plating Qualification), Materials Manufacturers (New Materials Qualification), Lead Free Product Qualification and R&D / Development.
DAGE 4000 Optima Bond tester
The fastest and most accurate bondtester. The Nordson DAGE 4000 Optima is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.
DAGE 3800+ Bondtester
The Nordson DAGE 3800+ bondtester is a new platform specifically configured for applications where system configurations are limited or where a dedicated, rather than multi-purpose function, is required.
DAGE 4600 Automated Bondtester
The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
DAGE 4800 Bondtester
The Nordson DAGE 4800 is at the forefront of wafer testing technology catering for the testing of wafers from 200mm up to 450mm.
DAGE 4800 INTEGRA Plus Bondtester
The 4800 INTEGRA Plus is the next generation automated bond test solution designed to meet the dynamic wafer-level packing environment. With its new motion, vision, and wafer handling system complemented by the high-throughput Paragon software, the system offers best-in-class micro bump and trace bond testing on chip-on-wafer, stacked wafer, and molded wafer applications.