HB05 Wedge & Ball Bonder
The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines.
HB10 Wedge & Ball Bonder
The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode.
HB16 Wedge & Ball Bonder
The HB16 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode.
HB30 Heavy Wire Bonder
The HB30 is a bench top size wire bonder, ideal for laboratories, pilot and pre-production runs and small scale production tines.
HB100 Automatic Wedge & Ball Bonder
The HB100 is a new generation of automatic desktop wire bonders. It is suited for laboratories and small volume productions. It performs wedge- and ball-bonding with one bond head.
PALOMAR 8100 Wire/Ball Bonder
The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar's proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.
PALOMAR 9000 Wedge Bonder
The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area.