锐峰先科技术有限公司

High speed bond shear testing offers a viable alternative to cumbersome and expensive board level drop testing. Essentially, high speed bond testing reproduces the configuration of drop testing by applying high strain rates to the solder bump.

 

The 4000HS Shear proudly maintains Nordson excellence in repeatable, reliability and most importantly the accuracy of measurement data, which are powered by carefully engineered motion system and patented high speed transducer technology.

 

Nordson 4000HS Shear test regime requires an area in which the tool (in reality, the test ball) can accelerate before contacting the ball. This is achieved by retracting the sample holder to an automatically calculated distance according to the speed chosen. Shear transducers covers industry standard solder bump and C4 bump sizes.

 

With Nordson Paragon™ software it takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, increasing efficiency and providing 100% confidence in your bond testing results.

 

Applications

 

The 4000HS Shear Bondtester supports your Semiconductor (Package Assembly and Test), Substrate Manufacturers (New Materials/Plating Qualification), Materials Manufacturers (New Materials Qualification), Lead Free Product Qualification and R&D / Development.

 

Brittle fracture and Drop & Impact Testing
Essentially, high speed bond testing reproduces the configuration of drop testing by applying high strain rates to the solder bump, thereby hardening the solder and largely transferring the load to the bond interface.

 

Test every interconnect on a device
BGA, CSP, QFN, SiP, MCM, solder joints, bond pad and substrate evaluation.