DAGE 4600 Automated Bondtester

Improve reliability and throughput while reducing human influence.

The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

Application

Electronic systems have a range of test requirements including wire pull, ball shear, die shear and surface mount shear. Batteries for the automotive industry must ensure the highest level of safety.

Microelectronics
Test every interconnect or die

• Leadframes and strips
• Package substrates
• BGA
• MEM

Battery
For battery systems the intercell connection technology requires mechanical testing in either:

• Wirebond Ribbon
• To Busbar
• Tab Weld
• Destructive mode (sample testing)
• Non-destructive mode

Wafer Level
Test wafers from 2 inches to 8 inches

• Silicon, glass, laminate, composite, compound and warped wafers
• Pillars and bumps <50µm
• Test in any direction with the rotational shear cartridge