Die Bonder
We provide TPT manual Die Bonder and PALOMAR fully automatic Die Bonder, which can be used in laboratories, research and development, pre production, small-scale and large-scale production.
Wire Bonder
We provide TPT manual/semi-automatic Wire Bonder and PALOMAR fully automatic Wire Bonder, suitable for semiconductor manufacturing in enterprises, universities, research institutes, and other fields.
Vacuum Pressure Furnace
The SST Vacuum Pressure Furnace is a range of vacuum and pressure furnaces designed for flux-free, void-free soldering in microelectronic packaging .
Bondtester
Nordson's high-precision push-pull force testing equipment is suitable for testing and analyzing the welding strength of semiconductor packaging.
X-ray inspection
Nordson's X-ray inspection system is used for non-destructive testing and failure analysis of traditional packaging.
Acoustic Inspection Systems
The Sonoscan C-SAM ultrasonic scanning microscope provides excellent accuracy and robustness, and is specifically designed as a general purpose tool for failure analysis, process development, material characterization and low volume production inspection.
Lapping and polishing systems
ASAP-1 Backside Preparation & Mechanical Decapsulation、ULTRAPOL Advance Lapping and Polishing Machine(Polishing accuracy 40nm). These are used for precision grinding and polishing of various chip devices in the laboratory.
Decapsulation
We provide RKD acid decapsulator & Laser decapsulation、BF1100 Can Opener、BF2100 Ceramic Package Opener, which are suitable for various packaging device unsealing applications for better semiconductor failure analysis.
Sheet Resistance Tester
The SURAGUS EddyCus TF lab series products are instruments suitable for laboratory research and development or finished product testing for measuring film surface resistance (square resistance) and film thickness.
Photo Emmission Microscope
It majors in the failure analysis of the IC through the Liquid Cristal& FMI.
Wafer Bonding
Advanced wafer bonding equipment provides high-precision alignment and bonding functions, suitable for bonding 200mm and 300mm wafers.
Characterization detection
We provide various non-contact 3D optical profilometers under the Sensofar brand, which can measure different textures, structures, roughness, and waviness at different surface scales.
Scanning Electron Microscopes
TESCAN high-resolution scanning electron microscope is suitable for analysis and research in the fields of semiconductor and microelectronics, materials science, life sciences, and earth sciences.
Wafer level X-ray inspection
XM8000 ™ - Automatic X-ray measurement for non-destructive testing and failure analysis of wafer level packaging.
Wafer level Acoustic Inspection Systems
Suitable for detecting bonded wafers, including bonding processes using direct fusion, anodic, glass frit and epoxy bonding.
UV lithography
High-throughput projection lithography scanner for 200mm and 300mm wafers in advanced packaging.
Automated in-line x-ray inspection system
The Matrix automatic online X-ray inspection system is suitable for inspecting semiconductor samples, wire bonding, SMT boards, high-power electronic modules, and final assembly of finished products in single/multi panel or pallet PCB assembly boards.
AOI Automated Optical Inspection System
Nordson's AOI automatic optical inspection equipment can detect various defects on bonding lines, chip mounting, and SMT at high speed to help users improve product quality and increase production.
Reflow Condensation Soldering
Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free and reliably for maximum return on investment.
Flying probe testers
Automated Test & Measurement Solutions for Electronics Manufacturers. Acculogic designs and manufactures Automated Test Systems engineered to validate the quality of your circuit assemblies & electronics in minimal time with exceptional test coverage.
Consumables
Provide：Hooks,Shears,Filament,Fluid & Tools For Polishing,Arc-lite Fluid ......