Wafer Bonding

Provide equipment related to wafer bonding process solutions, including permanent wafer bonding systems and Temporary wafer bonding solutions. If you need to know the detailed parameters of the equipment, please contact our personnel for further communication.

Bonding Solutions

Permanent Bonding: The permanent bonding systems deliver the precision and reliability needed for today´s advanced packaging. Sophisticated technologies for superior bond alignment and scalable platforms for diverse wafers and materials ensure device quality, maximum yield, and future-ready bonding from R&D to high-volume production.

Temporary Bonding: The temporary Bonding protects sensitive wafers during complex, multi-step processes – and enables residue-free debonding at critical stages.