8100 Wire/Ball Bonder

Taking fine wire bonding to new levels of productivity and efficiency for both operators and engineers. The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.

Processes
Ball Bumping, Gold Wire Bonding

Applications
• Large complex hybrids
• HB/HP LED arrays
• Optoelectronic packaging
• Chip-on-board (COB)
• System in packages (SiPs)
• Specialty lead frames
• Automotive assemblies
• Flex circuits
• Multi-chip modules (MCMs)
• Fine pitch devices
• LEDs with running stitch