The Model 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.
Applications
Void-Free Eutectic Die Attach
Flux-Free Solder Process Development
Assembly of High Reliability Microelectronic Packages
Hybrid Microelectronic Circuit Assembly
Fiber Optic Package Assembly
Ceramic Package Sealing
Specifications
| Operating Temperature Range |
100 to 500°C |
| Thermal Work Zone |
9 x 9 in (230 x 230mm) |
| Minimum Vacuum Level |
50 millitorr |
| Maximum Gas Pressure Level |
40 psig (3.7 bar) |
| Process Gasses |
N2 plus one option inert gas |
| Electrical Service |
8.1 kW maximum, 50 or 60 Hz, 110-120v; 380 volt 3 phase |
| Cooling Water Required |
2 gpm (8 lpm) @ 20-25°C, 2 kW minimum, 30 psig (2 bar) pressure differential |
| Chamber Depth |
4 in (100 mm) |
| Temperature uniformity |
<+/- 1% |
| Overall Size (W x D x H) |
40 x 35 x 42 in (102 x 89 x 107 cm) |
| Weight: |
800 lb (360 kg) |
