The Model 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of soldering tasks. A ramping temperature controller is combined with customized PLC's to provide automatic process control.
Processes
Void-Free Die Soldering
Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.
Hermetic Package Sealing
Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
Applications
• Automotive Diodes
• CPV Solar Cell Modules
• Fiber Optic Devices
• Flip Chips
• GaN MMIC's
• Hearing Aid Amplifiers
• Hermetic Feed-Throughs
• Implantable Medical Devices
• Laser Pump Diodes
• LED Lamps and Heaters
• Microwave Packages
• Miniature Crystals
• MMIC's
• Oscillators
• Pacemakers
• Power Modules
• Pressure Sensors
• Resistor Networks
• RF Amplifiers
Specifications
| Maximum Operating Temperature: |
450°C |
| Minimum Vacuum Level: |
100 millitorr (0.13 mbar) |
| Maximum Operating Pressure: |
50 psig (4.5 bar) |
| Heated Area: |
5.0 x 4.0 in (125 x 100 mm) |
| Recommended Process Area: |
4.5 x 3.5 in (115 x 90 mm) |
| Thermal Uniformity Process Area: |
5°C or better |
| Maximum Heating Rate in Vacuum: |
4°C/sec |
| Process Gasses: |
N2 plus one optional inert gas at 75 psig (3.5 kg/cm2) |
| Cooling Water: |
Optional - 1 gpm at 30 psig (4 lpm at 2kg/cm2) |
| Electrical Service: |
3.0 kVA max, 110 or 220 volts, single phase, 50/60 Hz |
| Overall Size (W x D x H): |
30.5 x 25 x 19 in (78 x 64 x 48 cm) |
| Weight: |
180 lb (80 kg) |
