Rehm Condenso Reflow Condensation Soldering

Simply. More. Technique.

In fact, Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free and reliably for maximum return on investment.

System advantages

Low operating costs
Profile longitudinal / lateral ±2 K
Ideal for PCBs with large thermal mass
Void-free thanks to vacuum option
Simple, accurate temperature profiling
Horizontal conveyor
Constant temperature
Inert gas soldering

Specifications:

Model	L * W * H
XM	310020301770 mm
XP	410020301770 mm
XPHS	410020301770 mm