Service Hotline:400-9988-118

锐峰先科技术有限公司

BE FIRST TECHNOLOGY CO., LTD

ASAP-1 IPS (Backside/Upside Preparation & Mechanical Decapsulation)


 

 

 

 

Every lab can now produce accurate, reproducible, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decap. is now straightforward and accurate.