6500 Die Bonder

The Palomar 6500 Die Bonder offers a balanced combination of accuracy, speed, and flexibility in a compact system footprint. The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds using its four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.

Processes
Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding

Applications
• P-side down laser diode attachment
• Silicon bench (V-Groove) placement
• High-density RF power transistors
• Ultra-fine pitch hybrid assemblies
• MEMS components
• VCSEL modules
• Data storage
• High-bright/high-power LED arrays
• Optoelectronic packaging
• LED printhead attachment
• Solar concentrator packaging