3880-II Die Bonder

A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II die bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible Palomar 3880-II is ideally suited for a range of markets and applications.

Processes
Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding, Thermocompression Die Bonding

Applications
• AOC - Active optical cable
• Chip-on-board
• CMOS sensors
• GaN/GaAs MMIC
• HB/HP LED assembly
• HPLD (high power laser diode)
• Hybrid microcircuits
• LiDAR
• Medical semiconductor & sensors
• MEMS / MOEMS
• Microwave modules
• Power electronics
• Quantum computing
• RF GaN 5G power amplifiers
• RF packages
• VCSEL, PD, DFB Laser, Lens Attach