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锐峰先科技术有限公司
BE FIRST TECHNOLOGY CO., LTD
About Us
Products
Traditional packaging
Die Bonder
Wire Bonder
Vacuum Pressure Furnace
Bondtester
Offline X-ray inspection
Automated in-line x-ray inspection system
Acoustic Inspection Systems
Scanning Electron Microscopes
Laboratory Equipment
Lapping and polishing systems
Decapsulation
Wire Bonder
Bondtester
X-ray inspection
Acoustic Inspection Systems
Scanning Electron Microscopes
Sheet Resistance Tester
Photo Emmission Microscope
Advanced Packaging
Wafer Bonding
Characterization detection
Scanning Electron Microscopes
Wafer level X-ray inspection
Wafer level Acoustic Inspection Systems
Micro-nano processing
UV lithography
Other Products
AOI Automated Optical Inspection System
Reflow Condensation Soldering
Flying probe testers
Consumables
Support
News
Message
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In 2022, due to the COVID-19, Shanghai Semicon China 2022 Exhibition was not held,
so we did't participate.
