Service Hotline：
400-9988-118
中文
|
English
锐峰先科技术有限公司
BE FIRST TECHNOLOGY CO., LTD
About Us
Products
Traditional packaging
Die Bonder
Wire Bonder
Vacuum Pressure Furnace
Bondtester
Offline X-ray inspection
Automated in-line x-ray inspection system
Acoustic Inspection Systems
Scanning Electron Microscopes
Laboratory Equipment
Lapping and polishing systems
Decapsulation
Wire Bonder
Bondtester
X-ray inspection
Acoustic Inspection Systems
Scanning Electron Microscopes
Sheet Resistance Tester
Photo Emmission Microscope
Advanced Packaging
Wafer Bonding
Characterization detection
Scanning Electron Microscopes
Wafer level X-ray inspection
Wafer level Acoustic Inspection Systems
Micro-nano processing
UV lithography
Other Products
AOI Automated Optical Inspection System
Reflow Condensation Soldering
Flying probe testers
Consumables
Support
News
Message
Contact Us
In Mar. 15-17, We get great successes in Semicon China 2016 show !
