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锐峰先科技术有限公司
BE FIRST TECHNOLOGY CO., LTD
About Us
Products
Traditional packaging
Die Bonder
Wire Bonder
Vacuum Pressure Furnace
Bondtester
Offline X-ray inspection
Automated in-line x-ray inspection system
Acoustic Inspection Systems
Scanning Electron Microscopes
Laboratory Equipment
Lapping and polishing systems
Decapsulation
Wire Bonder
Bondtester
X-ray inspection
Acoustic Inspection Systems
Scanning Electron Microscopes
Sheet Resistance Tester
Photo Emmission Microscope
Advanced Packaging
Wafer Bonding
Characterization detection
Scanning Electron Microscopes
Wafer level X-ray inspection
Wafer level Acoustic Inspection Systems
Micro-nano processing
UV lithography
Other Products
AOI Automated Optical Inspection System
Reflow Condensation Soldering
Flying probe testers
Consumables
Support
News
Message
Contact Us
Mar. 2006 We took part in the semicon China 2006 very
successfully many visitors visit our Booth.
