SST Model 5100 Vacuum Pressure Furnace

 

 

 

 

The Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.

Processes

Void-Free Die Soldering
Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.

Hermetic Package Sealing
Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Applications

Automotive Diodes
CPV Solar Cell Modules
EMI Filters
Fiber Optic Devices
Flip Chips
GaN MMIC's
Hearing Aid Amplifiers
Hermetic Feed-Throughs
Impantable Medical Devices
Laser Pump Diodes
LED Lamps and Heaters
Microwave Packages
Miniature Crystals
MMIC's
Oscillators
Pacemakers
Power Modules
Precision Capacitors
Resistor Networks
RF Amplifiers
Surge Suppressors

Specifications

Opearting Temperature Range 100 to 500°C
Thermal Work Zone 12 x 12 in = 144 in2 (30.5 x 30.5 cm = 930 cm2)
Minimum Vacuum Level < 50 millitorr (< .067 mbar)
Maximum Chamber Gas Pressure Level 40 psig (3.7 bar)
Process Gasses N2 required, (Ar He, forming gas optional) @ 90 psig (7 bar) minimum pressure. Formic acid generator (optional)
Electrical Service 208-240 volts, 50/60 Hz, three phase, 50 amps, 5 kW average, 20 kW maximum 380 volts, 50/60 Hz, three phase, 30 amps
Cooling Water Required 2 gpm (8 lpm) @ 20-25°C, 2 kW minimum, 30 psig (2 bar) pressure differential
Work Surface Height 39 in (99 cm)
Overall Size (W x D x H) 43 x 34 x 55 in (108 x 86 x 140 cm)
Weight 1000 lb (455 kg)



Blogroll:Befirst Baidu Google Alibaba HC360 SEMI

 
 
 
 

About us|Site map|Product halls|contact us

Copyright © Be First Technology Co.,Ltd 京ICP 06010381

中文|English